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Progress in 3-D IC production
December 9, 2010, 3-D Architectures for Semiconductor Integration and Packaging conference, Burlingame, CA— Bob Patti, CTO at Tezzaron Semiconductor illustrated the changes in complexity when changing...
View ArticleMonolithic 3-D Integration of Logic and Memory: Carbon Nanotube FETs,...
December 17, 2014, IEDM, San Francisco—Max M. Shulaker from Stanford showed the integration of logic and memory in a 3-D IC using RRAM and carbon nano-tubes. The demonstration circuit is an FPGA...
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